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Advanced Packaging Market to Exceed USD 109.9 Billion by 2031 as AI and Chiplets Redefine Semiconductor Industry

[Hyderabad, April 8th, 2025] - According to ClearView Market Insights analysis, the Global Advanced Packaging Market is projected to grow from USD 45.9 billion in 2023 to USD 109.9 billion by 2031, achieving a 13.9% CAGR. This explosive growth is driven by AI hardware demands, chiplet architectures, and the end of traditional transistors scaling.

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Industry Transformation Highlights

1. AI Hardware Revolution

  • NVIDIA's Blackwell GPUs utilize CoWoS-L packaging with 208 billion transistors
  • TSMC's CoWoS capacity will increase threefold by 2025 to meet AI demand
  • HBM3 memory stacks requiring ultra-precise TSVs technology

2. Chiplet Ecosystem Matures

  • UCIe 1.1 standard enabling multi-vendor chiplet designs
  • AMD's Zen 4c combining 5nm and 6nm chiplets
  • Intel's Ponte Vecchio with 47 active tiles

3. Mobile Innovation Continues

  • Apple's M3 Ultra using InFO-PoP technology
  • Qualcomm's Snapdragon 8 Gen 4 adopting FOPLP
  • 5G mmWave AiP solutions shrinking antenna sizes

Executive Perspectives

"Advanced packaging is no longer just about interconnects - it's becoming the foundation of system-level innovation. Our 3D hybrid bonding enables new architectures impossible with monolithic chips." Dr. Ann Kelleher, EVP of Technology Development, Intel

"The AI era demands packaging technologies that can deliver massive bandwidth at unprecedented power efficiency. Our CoWoS platform is enabling this revolution." Kevin Zhang, VP of Business Development, TSMC

Technology Impact Data

  • 3D packaging offers 1000x interconnect density compared to PCBs
  • Chiplet designs lower development costs by 40%
  • Advanced packages allow for a 50% power reduction for the same output performance

Future Outlook

  • 2025: Universal chiplet interoperability becomes reality
  • 2026: Optical interconnects in commercial use packages
  • 2028: 8HBM stacked with 1TB/s bandwidth

About the Report
This comprehensive analysis covers all advanced packaging platforms, material innovations, equipment trends, and application forecasts through 2031.

 

For more insights, visit https://clearviewmarketinsights.com/

About Clearview Market Insights:

Clearview Market Insights is a leading market research and consulting firm providing in-depth industry analysis and strategic recommendations for businesses worldwide.

 

Media contact:

Bhavani K
Marketing and Sales Head
ClearView Market Insights
Mail: 
sales@clearviewmarketinsights.com
Phone: +1 917-993-7369